Two complementary thermoelectric platforms delivering efficient solid-state temperature control — from localized chip hotspot cooling to complete thermal management systems.
TFTEC00 is SolidT’s ultra-thin, plateless thermoelectric platform, designed for highly localized temperature control with exceptional spatial resolution. Its architecture enables efficient thermal management in applications where compact integration and precise hotspot control are essential.
Single-Plate Thin-Film Thermoelectric Module
TFTEC01 extends SolidT’s thin-film technology to applications requiring larger active cooling areas. Its single-plate architecture provides a practical integration approach and, depending on the application, may offer advantages in manufacturability, system integration, and overall implementation cost.
We’re changing the way the World thinks about temperature management both heating and cooling.
We’re changing the way the World thinks about temperature management both heating and cooling.
Chip – The first active solid-state solution for direct on-chip cooling and heating
Module – Efficient thermal control for complete modules, with precise heating and cooling
System – Full-system heating and cooling using compact solid-state chillers and advanced temperature control units
