Setting the benchmark in thermal management

SOLIDT - Where the future of cooling and heating begins

SolidT develops solid-state heat pumps that deliver unmatched efficiency, providing thermal management solutions from chip to system level

SolidT delivers precise, solid-state heating and cooling directly on-chip —
enabling compact, efficient, and reliable thermal management for next- generation electronics and systems.

The technology scales from chip to system level in electronics, computing, and automotive, providing precise, solid-state temperature control

Team

We’re changing the way the World thinks about temperature management both heating and cooling.

Ziv Cohen

COO

Ariel Popper

CEO

Dr. Joseph Kaplun

CTO

Patented

International Application

No.PCT/IL2024/05984

U.S. Provisional Patent Application

No. 63/820,742

Partners

Revolution

SolidT drives a revolution in thermal management with high-performance solid-state thin-film heat pumps — thin, precise, efficient, and scalable from chip to system level

SolidT introduces a breakthrough in cooling and heating technology, replacing traditional mechanical systems with a solid-state solution that is compact, efficient, and maintenance-free.

A flexible technology, applicable across industries and scales — from systems to direct-to-chip — delivering precise, reliable, and energy-efficient thermal control